Active Device Substrate and Manufacturing Method Thereof

ABSTRACT

An active device substrate includes a flexible substrate, an inorganic de-bonding layer, and at least one active device. The flexible substrate has a first surface and a second surface opposite to the first surface, wherein the first surface is a flat surface. The inorganic de-bonding layer covers the first surface of the flexible substrate, and the material of the inorganic de-bonding layer is metal, metal oxide or combination thereof. The active device is disposed on or above the second surface of the flexible substrate.

RELATED APPLICATIONS

This application claims priority to Taiwan Application Serial Number102115623, filed May 1, 2013, which is herein incorporated by reference.

BACKGROUND

1. Technical Field

The present disclosure relates to an active device substrate.

2. Description of Related Art

Recently, a new display with a flexible active device substrate has beenlunched in the market. Because of its flexibility, the display devicemay replace the traditional papers or billboards.

In the manufacturing process of the flexible active device substrate, itis convenient to fix a flexible substrate on a glass plate and thendispose active devices on the flexible substrate to form the flexibleactive device substrate. Afterwards, the flexible active devicesubstrate is separated from the glass plate. However, when theattractive forces between the flexible substrate and the glass plate istoo large, it is difficult to completely separate the flexible substrateand the glass plate so that the active devices may be damaged.Therefore, many in the industry are striving to improve the peelingmanufacture of the flexible active device substrate.

SUMMARY

An aspect of the present invention provides an active device substrate.The active device substrate includes a flexible substrate, an inorganicde-bonding layer, and at least one active device. The flexible substratehas a first surface and a second surface opposite to the first surface.The first surface is a flat surface. The inorganic de-bonding layercovers the first surface of the flexible substrate. The material of theinorganic de-bonding layer is metal, metal oxide or a combinationthereof. The active device is disposed on or above the second surface ofthe flexible substrate.

In one or more embodiments, the material of the inorganic de-bondinglayer is metal. A thickness of the inorganic de-bonding layer is about0.001 to 1 μm. The material of the inorganic de-bonding layer is Au, Ag,Pt, Cu, Ti, Al, Cr, Pd, Rh, Mo, W, Zn, Sn, or a combination thereof.

In one or more embodiments, the material of the inorganic de-bondinglayer is metal oxide. A thickness of the inorganic de-bonding layer isabout 0.001 to 1 μm. The material of the inorganic de-bonding layer isIn₂O₃, SnO₂, ZnO, CdO, TiN, In₂O₃:Sn (ITO), ZnO:In (IZO), ZnO:Ga (GZO),ZnO:Al (AZO), SnO₂:F, TiO₂:Ta, CdIn₂O₄, Cd₂SnO₄, Zn₂SnO₄, or acombination thereof.

In one or more embodiments, the material of the flexible substrate ispolyimide (PI), polycarbonate (PC), polyethersulfone (PES),polynorbornene (PNB), polyetherimide (PEI), poly(p-phenylenebenzobisimidazole) (PBI), poly(p-phenylene benzobisoxazole) (PBO),poly(p-phenylene terephthalamide)(PPTA), or a combination thereof. Theinorganic de-bonding layer completely covers the first surface of theflexible substrate.

Another aspect of the present invention provides a manufacturing methodof an active device substrate including the following steps of: (Thesteps are not recited in the sequence in which the steps are performed.That is, unless the sequence of the steps is expressly indicated, thesequence of the acts is interchangeable, and all or part of the stepsmay be simultaneously, partially simultaneously, or sequentiallyperformed.)

A supporting plate is provided. An organic de-bonding layer is formed onthe supporting plate. An inorganic de-bonding layer is formed on theorganic de-bonding layer. The material of the inorganic de-bonding layeris metal, metal oxide, or a combination thereof. A flexible substrate isformed on the inorganic de-bonding layer. A surface of the flexiblesubstrate adjacent to the inorganic de-bonding layer is a flat surface.At least one active device is formed on or above the flexible substrate.

In one or more embodiments, the manufacturing method further includes:

The flexible substrate and the inorganic de-bonding layer are cut toform a stack structure formed by the inorganic de-bonding layer, theflexible substrate, and the active device. The organic de-bonding layerand the inorganic de-bonding layer are separated.

In one or more embodiments, the manufacturing method further includes:

The organic de-bonding layer is cut.

In one or more embodiments, the step of forming the organic de-bondinglayer is performed by physical vapor deposition (PVD), chemical vapordeposition (CVD), spin coating, spray coating, plasma modification, orprinting. The material of the organic de-bonding layer is parylene,silane, siloxane, organofluorine, FAS (Fluoroalkylsilane), or acombination thereof. The step of forming the inorganic de-bonding layeris performed by PVD, CVD, or sputtering. The manufacturing methodfurther includes:

The organic de-bonding layer is thermal annealed before forming theinorganic de-bonding layer.

Yet another aspect of the present invention provides a manufacturingmethod of a display device including the following steps:

The manufacturing method of an active device substrate mentioned above.At least one display element is formed on the at least one activedevice.

In one or more embodiments, the manufacturing method further includes:

The flexible substrate and the inorganic de-bonding layer are cut toseparate the organic de-bonding layer and the inorganic de-bonding layerbefore or after the step of forming the at least one display element onthe at least one active device.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1 to 7 are cross-sectional views of a manufacturing method of anactive device substrate according to one embodiment of the presentinvention;

FIG. 8 shows the stack structure is peeled from the organic de-bondinglayer;

FIG. 9 is a cross-sectional view of a display device according to oneembodiment of the present invention; and

FIG. 10 is a cross-sectional view of the display device according toanother embodiment of the present invention.

DETAILED DESCRIPTION

In the following detailed description, for purposes of explanation,numerous specific details are set forth in order to provide a thoroughunderstanding of the disclosed embodiments. It will be apparent,however, that one or more embodiments may be practiced without thesespecific details. In other instances, well-known structures and devicesare schematically depicted in order to simplify the drawings.

FIGS. 1 to 7 are cross-sectional views of a manufacturing method of anactive device substrate according to one embodiment of the presentinvention. Reference is made to FIG. 1. A manufacturer can provide asupporting plate 100 first. The supporting plate 100 in this embodimentcan be a rigid substrate, such as a glass, a quartz, or a siliconsubstrate.

Reference is made to FIG. 2. The manufacturer can form an organicde-bonding layer 200 on the supporting plate 100. The organic de-bondinglayer 200 can be selected to completely or partially cover thesupporting plate 100, or the manufacturer can design the size of theorganic de-bonding layer 200 according to the size of the active devicesubstrate. Basically, an embodiment falls within the scope of theclaimed invention if the active device substrate can be formed above theorganic de-bonding layer 200. Moreover, the organic de-bonding layer 200can be thermal annealed to remove impurities after it is formed on thesupporting plate 100.

The material of the organic de-bonding layer 200 can be parylene,silane, siloxane, FAS, or a combination thereof. The organic de-bondinglayer 200 can be formed by physical vapor deposition (PVD), chemicalvapor deposition (CVD), spin coating, spray coating, plasmamodification, or printing.

Reference is made to FIG. 3. Substantially, the manufacturer can form aninorganic de-bonding layer 300 on the organic de-bonding layer 200. Forexample, the inorganic de-bonding layer 300 can completely cover theorganic de-bonding layer 200. However, the scope of the claimedinvention should not be limited in this respect. In some embodiments,the inorganic de-bonding layer 300 can partially cover the organicde-bonding layer 200. Basically, an embodiment falls within the scope ofthe claimed invention if an active device can be formed above both ofthe inorganic de-bonding layer 300 and the organic de-bonding layer 200.The inorganic de-bonding layer 300 can be formed by PVD such assputtering, or CVD.

Reference is made to FIG. 4. Form a flexible material or a flexiblesubstrate 400 on the inorganic de-bonding layer 300. The flexiblesubstrate 400 can be formed on both of the organic de-bonding layer 200and the inorganic de-bonding layer 300, such that the organic de-bondinglayer 200 and the inorganic de-bonding layer 300 can be wrapped by theflexible substrate 400 and the supporting plate 100, as shown in FIG. 4.Alternatively, the flexible substrate 400 can be partially formed on theinorganic de-bonding layer 300. Basically, an embodiment falls withinthe scope of the claimed invention if the active device can be formedabove the flexible substrate 400, the inorganic de-bonding layer 300,and the organic de-bonding layer 200.

The material of the flexible substrate 400 can be polyimide (PI),polycarbonate (PC), polyethersulfone (PES), polynorbornene (PNB),polyetherimide (PEI), poly(p-phenylene benzobisimidazole) (PBI),poly(p-phenylene benzobisoxazole) (PBO), poly(p-phenyleneterephthalamide)(PPTA), or a combination thereof. The flexible substrate400 can be formed by spin coating, slot-die coating, or lamination.

Reference is made to FIG. 5. Substantially, the manufacturer can form atleast one active device, such as a thin-film transistor (TFT), on orabove the flexible substrate 400. In one or more embodiments, there canbe a plurality of the active devices to form an active device array 500disposed on or above the flexible substrate 400 if the active devicesubstrate is applied in a display device. Each active device of theactive device array 500 can be a switch to control the correspondingpixel unit of the display device. After the manufacture of FIG. 5, theinorganic de-bonding layer 300, the flexible substrate 400, and theactive device array 500 compose the active device substrate.

Reference is made to FIG. 6. The manufacturer can perform a cuttingtreatment along cutting lines 50 to define and align edges of the activedevice substrate. In greater detail, the manufacturer can cut at leastthe flexible substrate 400 and the inorganic de-bonding layer 300 alongthe cutting lines 50 to define a stack structure 10, i.e., the activedevice substrate, including the inorganic de-bonding layer 300, theflexible substrate 400, and the active device array 500. The cuttingtreatment can be laser cutting or mechanical cutting.

It should be noticed that although only the inorganic de-bonding layer300 and the flexible substrate 400 are cut in this embodiment, theorganic de-bonding layer 200 can also be cut in the cutting treatmentfor convenience in other embodiments. Moreover, the manufacturer canfurther cut the active device array 500 in the cutting treatmentaccording to real requirements although the active device array 500 isnot cut in FIG. 6.

Reference is made to FIG. 7. Substantially, the manufacturer canseparate the organic de-bonding layer 200 and the inorganic de-bondinglayer 300 to peel the stack structure 10 from the organic de-bondinglayer 200. In greater detail, there are different attractive forcesrespectively between the supporting plate 100 and the organic de-bondinglayer 200, between the organic de-bonding layer 200 and the inorganicde-bonding layer 300, and between the inorganic de-bonding layer 300 andthe flexible substrate 400. The attractive forces makes the layersmentioned above stack together. Since the attractive force between theorganic de-bonding layer 200 and the inorganic de-bonding layer 300 issmaller than the attractive forces between the supporting plate 100 andthe organic de-bonding layer 200, and between the inorganic de-bondinglayer 300 and the flexible substrate 400, a separation of the organicde-bonding layer 200 and the inorganic de-bonding layer 300 occurs firstwhen the manufacturer peels the structure disposed on the supportingplate 100, thereby leading to a peeling of the stack structure 10 fromthe supporting plate 100. Moreover, the organic de-bonding layer 200 isstill adhered on the supporting plate 100 after the peeling process. Thecutting traces of the organic de-bonding layer 200 formed in the cuttingtreatment are represented by dashed lines in FIG. 7.

Due to the weak attractive force between the organic de-bonding layer200 and the inorganic de-bonding layer 300, the manufacturer can do thepeeling process without exerting his or her strength. Consequently, withthe manufacturing method in this embodiment, damages of the activedevice array 500 above the inorganic de-bonding layer 300 can beprevented during the peeling process.

After the manufacture of FIG. 7, the active device substrate, i.e., thestack structure 10, includes the inorganic de-bonding layer 300, theflexible substrate 400, and the active device array 500. The flexiblesubstrate 400 has a first surface 410 and a second surface 420 oppositeto the first surface 410, where the first surface 410 is a flat surface.The inorganic de-bonding layer 300 completely covers the first surface410 of the flexible substrate 400, and the active device array 500 isdisposed above the second surface 420 of the flexible substrate 400.

In this embodiment, the material of the inorganic de-bonding layer 300can be metal, metal oxide, or a combination thereof. Since theattractive force between the organic de-bonding layer 200 and theinorganic de-bonding layer 300 of the active device substrate is weakdue to their significant material difference, the manufacturer canseparate them easily after performing the manufacture.

In greater detail, in one or more embodiments, the material of theinorganic de-bonding layer 300 can be metal, such as Au, Ag, Pt, Cu, Ti,Al, Cr, Pd, Rh, Mo, W, Zn, Sn, or a combination thereof. The attractiveforces between atoms in the inorganic de-bonding layer 300 are providedby metallic bonds, while the attractive forces between atoms in theorganic de-bonding layer 200 are mainly Van der Waals' forces. These twotype forces makes the attractive force between the inorganic de-bondinglayer 300 and the organic de-bonding layer 200 be weak, such that themanufacturer can separate them easily after performing the manufacture.The thickness of the inorganic de-bonding layer 300 may be about 0.001to 1 μm if the material of the inorganic de-bonding layer 300 is metal.Moreover, the inorganic de-bonding layer 300 is transparent if thethickness of the inorganic de-bonding layer 300 is about 0.001 to 0.02μm.

In one or more embodiments, the material of the inorganic de-bondinglayer 300 can be metal oxide, such as In₂O₃, SnO₂, ZnO, CdO, TiN,In₂O₃:Sn (ITO), ZnO:In (IZO), ZnO:Ga (GZO), ZnO:Al (AZO), SnO₂:F,TiO₂:Ta, CdIn₂O₄, Cd₂SnO₄, Zn₂SnO₄, or a combination thereof. Thethickness of the inorganic de-bonding layer 300 may be about 0.001 to 1μm if the material of the inorganic de-bonding layer 300 is metal oxide.

Since the material of the inorganic de-bonding layer 300 is metal ormetal oxide, the electrostatic charge aggregation below the stackstructure 10 produced upon peeling can be avoided, and the active devicearray 500 on the flexible substrate 400 will not be damaged by charge.In greater detail, reference is made to FIG. 8 which is an electrostatictest figure of the stack structure 10, the organic de-bonding layer 200,and the supporting plate 100 of FIG. 6 when the stack structure 10 ispeeling from the organic de-bonding layer 200. In this example, thesupporting plate 100 was made of glass, the organic de-bonding layer 200was made of FAS, the inorganic de-bonding layer 300 was made of metal,and the flexible substrate 400 was made of polyimide. The electrostatictest using an electrostatic meter 900 was processing when the stackstructure 10 was peeled from the organic de-bonding layer 200. Anelectrostatic voltage below the inorganic de-bonding layer 300 wasundetectable, which indicated the electrostatic voltage was too smallduring the peeling process. In contrast, an electrostatic voltagemeasured in a situation that the flexible substrate (made of polyamide)was directly peeled from the supporting plate (made of glass) was about−0.8 kV, which meant the electrostatic charge aggregation might be toostrong to damage the active device array disposed on or above theflexible substrate during the peeling process.

The following paragraphs provide detailed explanations with respect tothe manufacturing method of a display device in this embodiment. FIG. 9is a cross-sectional view of the display device according to oneembodiment of the present invention. In this embodiment, the activedevice 502 is a bottom gate thin film transistor. The active device 502includes a gate electrode 520, a gate insulator layer 530, a channellayer 540, a source electrode 550, and a drain electrode 560. The gateelectrode 520 is disposed above the flexible substrate 400. The channellayer 540 is disposed above the gate electrode 520. The gate insulatorlayer 530 is disposed between the channel layer 540 and the gateelectrode 520. The source electrode 550 and the drain electrode 560 aredisposed on the channel layer 540, and are electrically connected to thechannel layer 540, respectively.

In greater detail, the material of the gate 520 can include Ti, Mo, Cr,Ir, Al, Cu, Ag, Au, Zn, In, Ga, a combination thereof, or an alloythereof. For example, the manufacturer can form a first conductive layerfirst, and then pattern the first conductive layer to form the gateelectrode 520 above the flexible substrate 400. The first conductivelayer can be formed by PVD such as sputtering, or CVD, and the method ofpatterning the first conductive layer can be lithography and etching,screen printing, ink-jet printing, or laser ablation.

The material of the gate insulator layer 530 can include siliconnitride, silicon oxide, silicon oxynitride, or a combination thereof.The gate insulator layer 530 can be formed by CVD.

The material of the channel layer 540 can include amorphous silicon,polycrystalline silicon, microcrystalline silicon, monocrystallinesilicon, organic semiconductor, oxide semiconductor, or a combinationthereof. For example, the manufacturer can form a semiconductor layerfirst, and then patterning the semiconductor layer to form the channellayer 540 on the gate insulator layer 530. The semiconductor layer canbe formed by PVD such as sputtering, or CVD, and the first conductivelayer can be patterned by lithography and etching, screen printing,ink-jet printing, or laser ablation.

The material of the source electrode 550 and the drain electrode 560 caninclude Ti, Mo, Cr, Ir, Al, Cu, Ag, Au, Zn, In, Ga, a combinationthereof, or an alloy thereof. For example, the manufacturer can form asecond conductive layer first to cover the channel layer 540 and thegate insulator layer 530. Substantially, the manufacturer can patternthe second conductive layer to form the source electrode 550 and thedrain electrode 560 respectively disposed at two sides of the channellayer 540. The forming method of the second conductive layer can beconducted by PVD such as sputtering, or CVD, and the patterning methodof the first conductive layer can be conducted by lithography andetching.

In one or more embodiments, a buffer layer 450 can be disposed betweenthe flexible substrate 400 and the active device 502. The buffer layer450 can completely cover the flexible substrate 400 to prevent thedamages of the flexible substrate 400. The material of the buffer layer450 can be silicon nitride, and the buffer layer 450 can be formed byPVD such as sputtering, or CVD.

Moreover, the active device 502 can further include a passivation layer570 to cover the gate insulator layer 530, the channel layer 540, thesource electrode 550, and the drain electrode 560. The passivation layer570 can have a via hole 572 to expose the drain electrode 560 of theactive device 502, such that the active device 502 can be electricallyconnected to other elements through the via hole 572. In thisembodiment, the material of the passivation layer 570 can includesilicon nitride, silicon oxide, silicon oxynitride, or a combinationthereof. The passivation layer 570 can be formed by spin coating, andthe via hole 572 can be formed by lithography and etching.

The active device 502 can be a switch for the pixel unit of the displaydevice. For a liquid crystal display device, the drain electrode 560 ofthe active device 502 can be electrically connected to a pixelelectrode. For an electroluminescence display device, the drainelectrode 560 of the active device 502 can be electrically connected toan electrode of an electroluminescence element, such as a light emittingdiode or an organic light emitting diode, to provide a driving voltageto the electroluminescence element. For an electrowetting displaydevice, the drain electrode 560 of the active element 502 can beelectrically connected to a pixel electrode to change the position ofpolar molecules therein. For an electrophoresis display device, thedrain electrode 560 of the active device 502 can be electricallyconnected to a pixel electrode to change the positions of colorparticles in microencapsulations therein.

As such, for convenience, the manufacturer can choose to fabricate adisplay element 600 after fabricating the active element 502. Thedisplay element 600 includes a first electrode 610, a pixel define layer620, a luminous layer 630, and a second electrode 640. The firstelectrode 610 is disposed above the active device 502, and iselectrically connected to the drain electrode 560 of the active element502. The pixel define layer 620 covers the first electrode 610 and theactive device 502. The pixel define layer 620 has a pixel opening 622 toexpose a portion of the first electrode 610. The luminous layer 630 isdisposed on the first electrode 610 and in the pixel opening 622. Thesecond electrode 640 covers the luminous layer 630.

In greater detail, the material of the first electrode 610 can includeindium tin oxide, indium zinc oxide, aluminum zinc oxide, or acombination thereof. For example, the manufacturer can form a thirdconductive layer on the active device 502 to cover the active device 502completely. Substantially, the manufacturer can pattern the thirdconductive layer to form the first electrode 610. In this embodiment,the third conductive layer can be formed by PVD such as sputtering, orCVD, and the third conductive layer can be patterned by lithography andetching.

In this embodiment, the material of the pixel define layer 620 caninclude organic material, inorganic material, or a combination thereof.The pixel define layer 620 can be formed by spin coating, and the pixelopening 622 can be formed by lithography and etching.

In one or more embodiments, from a terminal of the luminous layer 630adjacent to the first electrode 610, the structure of the luminous layer630 includes a hole transport layer, an organic light emitting layer,and a electron transport layer in sequence. However, the scope of theclaimed invention should not be limited in this respect.

The material of the second electrode 640 can include indium tin oxide,indium zinc oxide, aluminum zinc oxide, or a combination thereof. Thesecond electrode 640 can be formed by PVD such as sputtering, or CVD.

The active device 502 mentioned above should not limit the scope of theclaimed invention. In one or more embodiments, the active device can bea top gate thin film transistor. FIG. 10 is a cross-sectional view ofthe display device according to another embodiment of the presentinvention. An active device 702 includes a channel layer 720, a gateinsulator layer 730, a gate electrode 740, a source electrode 750, and adrain electrode 760. The channel layer 720 is disposed above theflexible substrate 400. The gate insulator layer 730 covers the channellayer 720. The gate insulator layer 730 has a first opening 732 and asecond opening 734 to respectively expose portions of the channel layer720. The gate electrode 740 is disposed on the gate insulator layer 730,such that the gate insulator layer 730 is disposed between the channellayer 720 and the gate electrode 740. The source electrode 750 and thedrain electrode 760 are both disposed on the gate insulator layer 730,and they are electrically connected to the channel layer 720 through thefirst opening 732 and the second opening 734, respectively.

The active device 702 can be a switch for the pixel unit of the displaydevice. As such, the manufacturer can choose to fabricate a displayelement 600 after fabricating the active element 702. Other relevantstructural details of the present embodiment are all the same as theembodiment shown in FIG. 9, and, therefore, a description in this regardwill not be repeated hereinafter.

In one or more embodiments, the cutting treatment can be performed afterfabricating the display element 600. In greater detail, the manufacturercan fabricate the active device 502 or 702 and the display element 600of FIG. 9 or FIG. 10 above the flexible substrate 400 in sequence afterperforming the manufacture of FIG. 4. As shown in FIG. 6, the cuttingtreatment including cutting the flexible substrate 400 and the inorganicde-bonding layer 300 to define the edges of the stack structure 10 canbe performed after fabricating the display element 600. As such, in thisembodiment, the stack structure 10 includes the inorganic de-bondinglayer 300, the flexible substrate 400, the active device 502 (or 702),and the display element 600. Thus, the stack structure 10 can be peeledfrom the supporting plate 100 by separating the inorganic de-bondinglayer 300 and the organic de-bonding layer 200 to finish the manufactureof the display device.

However, in other embodiments, the cutting treatment can be performedafter fabricating the active device substrate and before fabricating thedisplay element 600 (see FIG. 9 and FIG. 10). In greater detail, themanufacturer can fabricate the active device 502 of FIG. 9 or 702 ofFIG. 10 above the flexible substrate 400 after performing themanufacture of FIG. 4. Substantially, the manufacturer can perform thecutting treatment as shown in FIG. 6, and then form the display element600 on the active device 502 or 702. Thus, the manufacture of formingthe display device is complete after separating the inorganic de-bondinglayer 300 and the organic de-bonding layer 200.

It will be apparent to those skilled in the art that variousmodifications and variations can be made to the structure of the presentinvention without departing from the scope or spirit of the invention.In view of the foregoing, it is intended that the present inventioncover modifications and variations of this invention provided they fallwithin the scope of the following claims.

What is claimed is:
 1. An active device substrate, comprising: aflexible substrate having a first surface and a second surface oppositeto the first surface, wherein the first surface is a flat surface; aninorganic de-bonding layer disposed on the first surface of the flexiblesubstrate, wherein the material of the inorganic de-bonding layer ismetal, metal oxide or a combination thereof; and at least one activedevice disposed on or above the second surface of the flexiblesubstrate.
 2. The active device substrate of claim 1, wherein thematerial of the inorganic de-bonding layer is metal, and a thickness ofthe inorganic de-bonding layer is about 0.001 to 1 μm, wherein thematerial of the inorganic de-bonding layer is Au, Ag, Pt, Cu, Ti, Al,Cr, Pd, Rh, Mo, W, Zn, Sn, or a combination thereof.
 3. The activedevice substrate of claim 1, wherein the material of the inorganicde-bonding layer is metal oxide, and a thickness of the inorganicde-bonding layer is about 0.001 to 1 μm, wherein the material of theinorganic de-bonding layer is In₂O₃, SnO₂, ZnO, CdO, TiN, In₂O₃:Sn(ITO), ZnO:ln (IZO), ZnO:Ga (GZO), ZnO:Al (AZO), SnO₂:F, TiO₂:Ta,CdIn₂O₄, Cd₂SnO₄, Zn₂SnO₄, or a combination thereof.
 4. The activedevice substrate of claim 1, wherein the material of the flexiblesubstrate is polyimide (PI), polycarbonate (PC), polyethersulfone (PES),polynorbornene (PNB), polyetherimide (PEI), poly(p-phenylenebenzobisimidazole) (PB), poly(p-phenylene benzobisoxazole) (PBO),poly(p-phenylene terephthalamide)(PPTA), or a combination thereof,wherein the inorganic de-bonding layer completely covers the firstsurface of the flexible substrate.
 5. A manufacturing method of anactive device substrate, comprising: providing a supporting plate;forming an organic de-bonding layer on the supporting plate; to formingan inorganic de-bonding layer on the organic de-bonding layer, whereinthe material of the inorganic de-bonding layer is metal, metal oxide, ora combination thereof; forming a flexible substrate on the inorganicde-bonding layer, wherein a surface of the flexible substrate adjacentto the inorganic de-bonding layer is a flat surface; and forming atleast one active device on or above the flexible substrate.
 6. Themanufacturing method of claim 5, further comprising: cutting theflexible substrate and the inorganic de-bonding layer to form a stackstructure which is formed by the inorganic de-bonding layer, theflexible substrate and the active device; and separating the organicde-bonding layer and the inorganic de-bonding layer.
 7. Themanufacturing method of claim 6, further comprising: cutting the organicde-bonding layer.
 8. The manufacturing method of claim 5, wherein thestep of forming the organic de-bonding layer is performed by physicalvapor deposition (PVD), chemical vapor deposition (CVD), spin coating,spray coating, plasma modification, or printing, wherein the material ofthe organic de-bonding layer is parylene, silane, siloxane,organofluorine, FAS, or a combination thereof, wherein the step offorming the inorganic de-bonding layer is performed by PVD, CVD, orsputtering, and the manufacturing method further comprises: to thermalannealing the organic de-bonding layer before forming the inorganicde-bonding layer.
 9. A manufacturing method of a display device,comprising: the manufacturing method of an active device substrate ofclaim 5; and forming at least one display element on the at least oneactive device.
 10. The manufacturing method of claim 9, furthercomprising: cutting the flexible substrate and the inorganic de-bondinglayer to separate the organic de-bonding layer and the inorganicde-bonding layer before the step of forming the at least one displayelement on the at least one active device.
 11. The manufacturing methodof claim 9, further comprising: cutting the flexible substrate and theinorganic de-bonding layer to separate the organic de-bonding layer andthe inorganic de-bonding layer after the step of forming the at leastone display element on the at least one active device.